Capital HPLC

Selection Table

Selection Table

USP Code

PhasesComposition

CapitalHPLC Recommedation

G1

dimethylpolysiloxaneoil

IC-1,IC-1ms

G2

dimethylpolysiloxanegum

IC-1,IC-1ms

G3

50%phenyl -50%methylpolysiloxane

IC-50

G4

diethyleneglycolsuccinatepolyester

DEGS

G5

2-cyanopropylpolysiloxane

BPX-70

G6

trifluoropropylmethylpolysiloxane

IC-210

G7

50%3-cyanopropl -50%phenylmethysilicone

007-225,SP-2300

G8

90%3-cyanopropyl-10% phenylmethylsilicon

SP-2330

G9

methylvinylpolysiloxane

UCW982

G10

polyamide

PolyA-103

G11

bis(2-ethylhexyl)sebacatepolyester

Di-Octylsebacate

G12

phenyldiethanolaminesuccinatepolyester

 

G13

sorbitol

 

G14

polyethyleneglycol (av.mol.w tof 950to 1050)

IC-Wax1000

G15

polyethyleneglycol (av.mol.w tof 3000to 3700)

IC-Wax4000

G16

polyethylene glycol compound(av.mol.w t.About15,000to20,000).Ahighmolecular weight compoundofpolyethyleneglycol andadiepoxide.

IC-Wax20M

G17

75%phenyl -25%methylpolysiloxane

IC-50

G18

polyalkyleneglycol

UCONLB 550X

G19

25%phenyl -25%cyanopropyl -50%methylsilicone

007-225,OV225

G20

polyethyleneglycol (av.mol.w t.380-420)

IC-Wax400

G21

neopentylglycolsuccinate

 

G22

bis(2-ethylhexyl)phthalate

 

G23

polyethyleneglycol adipate

 

G24

disodecylphthalate

 

G25

polyethylene glycol compoundTPA. Ahighmolecular weightcompoundofa polyethylene glycol andadiepoxide that isesterifiedw ithterephthalicacid.polyethyleneglycol andadiepoxidethat isesterifiedw ithterephthalicacid.

IC-FFAP,IC-Wax20M-TPA

G26

polyethyleneglycol andadiepoxide that isesterifiedw ithterephthalic acid.

XE-60

G27

25%2-cyanoethyl-75% methylpolysiloxane

IC-5ms

G28

5%phenyl- 95% methylpolysiloxane

IC-35

G29

25%phenyl -75%methylpolysiloxane

 

G30

ß-ß-thiodipropionitrile

 

G31

tetraethylene glycol dimethylether (av.Ethyleneoxychainlength is30);Non

IgepalCO-880

G32

20%phenylmethyl -80%dimethylpolysiloxane

IC-35

G33

20%carborane -80%methylsilicone

Dexsil 300

G34

ciethyleneglycolsuccinatepolyesterstabilized withphosphoric acid

DEGS-PS

G35

Ahighmolecular weightcompoundofapolyethyleneglycolanda diepoxidethatisesterified withnitro-terephthalic acid.

IC-FFAP

G36

1%vinyl -5%phenylmethylpolysiloxane

IC-5

G37

polyamide

PolyI-110

G38

PhaseG1containing asmallpercentageofatailing inhibitor.

IC-1,IC-1ms

G39

Polyethyleneglycol (av.mol.w t.About1500)

IC-Wax,ICPureWax

G40

ethyleneglycoladipate

 

G41

phenylmethyldimethysilicone(10%phenyl substituted)

IC-5

G42

35%phenyl- 65%dimethylvinylsiloxane(percentagesrefertomolar substit

IC-35

G43

6% cyanopropylphenyl -94%dimethylpolysiloxane(percentages ref ertomolar subsitution)

IC-624

G46

14%Cyanopropylphenyl-86% methylpolysiloxane

IC-1701

 

 

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